Title:
A processing device including a clamping mechanism
Document Type and Number:
Japanese Patent JP6147497
Kind Code:
B2
Abstract:
A manufacturing device having a clamp unit according to an exemplary embodiment of the present invention may include a workpiece disposed on a frame, a clamp unit configured to fix the workpiece on the frame, and a spindle configured to a torque transferred from a motor to cut the workpiece or operates the clamp unit to make the clamp unit fix the workpiece on the frame.
Inventors:
Rim, Don, Shik
Lee, Sun, Chang
Min, Hong, Shiku
Chang, Hyun, Jun
Lee, Sun, Chang
Min, Hong, Shiku
Chang, Hyun, Jun
Application Number:
JP2012273330A
Publication Date:
June 14, 2017
Filing Date:
December 14, 2012
Export Citation:
Assignee:
HYUNDAI MOTOR COMPANY
International Classes:
B23Q3/06
Domestic Patent References:
| JP2005111598A | ||||
| JP2063943U | ||||
| JP11188551A | ||||
| JP2009045701A |
Attorney, Agent or Firm:
Takeshi Sekine
Hirohito Katsunuma
Yukihiro Hotta
Jie Yamanoi
Hirohito Katsunuma
Yukihiro Hotta
Jie Yamanoi