Title:
加工装置
Document Type and Number:
Japanese Patent JP7444633
Kind Code:
B2
Abstract:
To quickly wash the upper surface of a wafer.SOLUTION: A processing device 1 includes a chuck table 2 that holds a workpiece 15 on a holding surface 200, processing means 3 that processes the workpiece 15 held on the holding surface 200, and a first conveyance pad 608 that conveys the workpiece 15. In the processing device, by using the first conveyance pad 608 including water layer forming means 9 and an ultrasonic vibrator 50 provided on the first conveyance pad 608, water 51 is supplied to an upper surface 150 of the workpiece 15 from a water supply source 90 provided in the water layer forming means 9, and a water layer 52 is formed on the upper surface 150 of the workpiece 15; then, power is supplied to the ultrasonic vibrator 50 from a high frequency power source unit 5 to vibrate the ultrasonic vibrator 50 to propagate ultrasonic vibration, caused by the ultrasonic vibrator 50, to the water layer 52. Thus, the upper surface 150 of the workpiece 15 is washed by the water 51 of the water layer 52.SELECTED DRAWING: Figure 2
Inventors:
Atsushi Nakatsuka
Application Number:
JP2020028104A
Publication Date:
March 06, 2024
Filing Date:
February 21, 2020
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/677; B24B7/00; B24B41/06; B24B55/06; H01L21/304
Domestic Patent References:
| JP2001326205A | ||||
| JP2003059875A | ||||
| JP2010087443A | ||||
| JP2015082570A | ||||
| JP2009252877A | ||||
| JP2001087725A |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office