Title:
加工装置
Document Type and Number:
Japanese Patent JP7450700
Kind Code:
B2
Abstract:
A processing apparatus includes a chuck configured to hold a substrate; a moving unit to which a processing tool configured to process the substrate is mounted; a sprinkler configured to spray a cleaning liquid configured to clean the moving unit from an outside of the moving unit; and a housing accommodating the chuck, the processing tool, and the sprinkler therein. The sprinkler includes a fixed unit fixed to an inside of the housing, and a rotating unit rotatably supported at the fixed unit. The rotating unit includes a nozzle configured to discharge the cleaning liquid, and a rotation block configured to hold the nozzle.
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Inventors:
Takaaki Wakamatsu
Application Number:
JP2022501793A
Publication Date:
March 15, 2024
Filing Date:
February 05, 2021
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B23Q11/00; B23Q17/20; B24B7/00; B24B55/06; H01L21/304
Domestic Patent References:
| JP2017127910A | ||||
| JP2017094420A | ||||
| JP2017059809A | ||||
| JP2011049578A | ||||
| JP2017047510A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito