Title:
加工装置
Document Type and Number:
Japanese Patent JP7457533
Kind Code:
B2
Abstract:
To provide a processing device configured so that a grindstone can be easily detached when replacing the grindstone.SOLUTION: The processing device comprises: a disk-like spindle flange 17 connected to a spindle; and a grindstone 14 which comprises an annular base metal part 37 detachably attached to the spindle flange 17 to nearly closely contact a lower surface of the spindle flange 17 and a grindstone part 38 arranged on the lower surface of the base metal part 37 and integrated with the base metal part 37; and air blowout ports 29a and 29b through which air 100 is blown out to a closely contact position between the spindle flange 17 and the base metal part 37.SELECTED DRAWING: Figure 4
Inventors:
Osamu Shiratori
Application Number:
JP2020037294A
Publication Date:
March 28, 2024
Filing Date:
March 04, 2020
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B45/00; B24B7/00
Domestic Patent References:
| JP2014100772A | ||||
| JP62110856U | ||||
| JP10000555A |
Attorney, Agent or Firm:
Takamitsu Shimizu