Title:
A processing method of a wafer
Document Type and Number:
Japanese Patent JP6116155
Kind Code:
B2
Inventors:
Yasutaka Mizomoto
Application Number:
JP2012181925A
Publication Date:
April 19, 2017
Filing Date:
August 20, 2012
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/02; H01L21/304
Domestic Patent References:
| JP2011258841A | ||||
| JP2011040511A | ||||
| JP2005026413A | ||||
| JP2007165769A | ||||
| JP2007508704A |
Attorney, Agent or Firm:
Hiroaki Sakai