Title:
加工システム
Document Type and Number:
Japanese Patent JP7469921
Kind Code:
B2
Abstract:
To provide a chuck device that can suppress a wafer from being damaged, by suppressing machining chips from accumulating in a chuck, and a machining system.SOLUTION: A chuck table 3 comprises: a first porous chuck 31; a second porous chuck 32 provided at an outer periphery of the first porous chuck 31; a vacuum source S1, connected individually to the first porous chuck 31 and the second porous chuck 32, which supplies a negative pressure to the first porous chuck 31 and the second porous chuck 32; and a water supply source S2, connected individually to the first porous chuck 31 and the second porous chuck 32, which supplies pure water to the first porous chuck 31 and the second porous chuck 32, where the water supply source S2 supplies pure water to the second porous chuck 32 when the first porous chuck 31 adsorbs and holds a small-diameter work-piece.SELECTED DRAWING: Figure 3
Inventors:
Tomohiko Makino
Application Number:
JP2020044812A
Publication Date:
April 17, 2024
Filing Date:
March 13, 2020
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B23Q11/00; B23Q3/08; B24B7/00; B24B41/06; B24B55/06; H01L21/304; H01L21/683
Domestic Patent References:
| JP2009135132A | ||||
| JP2002324831A | ||||
| JP2012178447A | ||||
| JP2016097463A |
Attorney, Agent or Firm:
Takamitsu Shimizu