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Title:
The product which has a manufacturing method of a microneedle array manufacture device and a microneedle array, and a microneedle array
Document Type and Number:
Japanese Patent JP6001043
Kind Code:
B2
Abstract:
A microneedle patch with which a treatment is reliably completed in a short time when a microneedle is administered into skin or mucous membrane is provided. A microneedle patch (100F) includes a base member (101) and a plurality of microneedles (103g) supported by the base member (101). Each microneedle (103g) includes a top-section layer (104) comprising a biologically active substance to be inserted in dermis (310), and an intermediate layer (106) provided between the top-section layer (104) and the base member (101), having a composition having breaking strength weaker than breaking strength of a composition of the top-section layer (104), and having a thickness of 5 µm and 100 µm inclusive.

Inventors:
Shinya Yamada
Chiyama Daihaku
Kensaku Akita
Takako Ueno
Yuko Ide
Sachi Nagai
Akano Naganobu
Ichiro Ono
Kanji Takada
Application Number:
JP2014252907A
Publication Date:
October 05, 2016
Filing Date:
December 15, 2014
Export Citation:
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Assignee:
NISSHA PRINTING CO.,LTD.
Labo Jeversa Co., Ltd.
Bio Serentac Co., Ltd.
International Classes:
A61M37/00; B81B1/00
Domestic Patent References:
JP2012196426A
JP2014519344A
JP2010184102A
JP2014082975A
JP2014199881A
Foreign References:
US20080269685