Title:
A radiation-sensitive resin composition, a hardening film, a light emitting element, a wavelength conversion film, and a formation method of a luminous layer
Document Type and Number:
Japanese Patent JP6094406
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which contains quantum dots formed of a safe material, has excellent radiation sensitivity, and is capable of forming a highly reliable cured film excellent in fluorescent characteristics, and to provide a light-emitting element, a wavelength conversion film, and a method for forming a light-emitting layer.SOLUTION: The radiation-sensitive resin composition contains: [A] a polymer which has a structural unit containing a group represented by formula (1) and an epoxy group-containing structural unit in the same or different polymer molecules; [B] a photoacid generator; and [C] semiconductor quantum dots. A cured film of the radiation-sensitive resin composition formed on a substrate 12 serves as a wavelength conversion film, and it is used as a light-emitting layer 13 to form a wavelength conversion substrate 11. The wavelength conversion substrate 11 is combined with a light source substrate 18 provided with a light source 17 to constitute a light-emitting display element 100.
Inventors:
Hideyuki Kami
Application Number:
JP2013145890A
Publication Date:
March 15, 2017
Filing Date:
July 11, 2013
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/004; G02B5/20; G03F7/039; H01L51/50; H05B33/12
Domestic Patent References:
| JP2013080192A | ||||
| JP2012022048A | ||||
| JP2009543159A | ||||
| JP2006514709A |
Foreign References:
| WO2006103908A1 | ||||
| WO2006100957A1 |
Attorney, Agent or Firm:
Masao Sekiguchi
Takamasa Nakano
Yusei Atsuya
Atsuko Oaku
Takamasa Nakano
Yusei Atsuya
Atsuko Oaku