Title:
The radiator article for semiconductor devices
Document Type and Number:
Japanese Patent JP5988977
Kind Code:
B2
Abstract:
Disclosed is a heat dissipating component for a semiconductor element, having a tabular body 0.4-6 mm in thickness containing 40-70 volume% of diamond particles, with the balance comprising metal of which the principal component is aluminum, and coated on both surfaces by a coating layer comprising metal of which the principal component is aluminum, or an aluminum-ceramic based composite material, to form an aluminum-diamond based composite body. On at least the two major surfaces thereof are formed, in order from the major surface side, (1) an amorphous Ni alloy layer 0.1-1 µm in film thickness, (2) an Ni layer 1-5 µm in film thickness, and (3) an Au layer 0.05-4 µm in film thickness, the ratio of the Ni alloy layer and the Ni layer (Ni alloy layer thickness/Ni layer thickness) being 0.3 or less.
Inventors:
Hideki Hirotsuru
Hideo Tsukamoto
Yosuke Ishihara
Hideo Tsukamoto
Yosuke Ishihara
Application Number:
JP2013525676A
Publication Date:
September 07, 2016
Filing Date:
July 17, 2012
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
H01L23/373; B22D18/02; C22C26/00
Domestic Patent References:
| JP2004200346A | ||||
| JP2007247058A | ||||
| JP2008258511A |
Foreign References:
| WO2010007974A1 | ||||
| WO2010007922A1 |
Attorney, Agent or Firm:
Kobayashi Yoshinori
Sonoda Yoshitaka
Sonoda Yoshitaka
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