Title:
リレー装置
Document Type and Number:
Japanese Patent JP7411482
Kind Code:
B2
Abstract:
As a relay device equipped with a relay having a mechanical contact point, the relay device allows a reset operation of a coefficient value not to be required when replacing a relay, and allows to accurately determine a replacement timing and the like even in a case of replacing the relay that has been used up to the middle. The relay device is configured with: a relay mounting substrate (20) mounted with a relay (21) and capable of being replaced with the relay (21) mounted thereon; a non-volatile memory (22) installed on relay mounting substrate (20); and a microprocessor (MPU) (32) provided separately from the relay mounting substrate (20) and writing the information related to the relay (21) to the non-volatile memory (EEPROM) (22).
Inventors:
Hiroaki Nagata
Application Number:
JP2020066674A
Publication Date:
January 11, 2024
Filing Date:
April 02, 2020
Export Citation:
Assignee:
Nidek Instruments Co., Ltd.
International Classes:
H01H47/00
Domestic Patent References:
| JP2007157476A | ||||
| JP200011832A | ||||
| JP201383523A | ||||
| JP2009170261A |
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata
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