Title:
RESIN COMPOSITION AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016204506
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which has low stress property and low out gas property in low temperature burning at 250°C or less and further can provide a cured film having good mechanical properties.SOLUTION: The resin composition is provided that contains: a copolymer of a polybenzooxazole precursor and alkali soluble polyimide, represented by the general formula (1); and a solvent, in the formula (1), Ris a bivalent organic group, Ris an organic group having an alkyl chain structure having 5 to 20 carbon atoms, Ris a tetravalent organic group, Ris bivalent organic group, l and m are each structural unit number, structural unit of A and B may be block or random copolymer, l>0, m>0 and l+m is in a range of thousand to ten million.SELECTED DRAWING: None
Inventors:
TAKEYAMA HIROKI
MASUDA YUKI
MASUDA YUKI
Application Number:
JP2015087254A
Publication Date:
December 08, 2016
Filing Date:
April 22, 2015
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09D179/08; C08G73/06; C09D7/12; C09D179/04; G03F7/023; G03F7/20; G03F7/40
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