A resin composition, a heat-sealing agent, a layered product, a solar cell module

Title:

A resin composition, a heat-sealing agent, a layered product, a solar cell module

Document Type and Number:

Japanese Patent JP5928770

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in e.g. adhesiveness to polyester film and the like and with which an adhesive layer, a heat sealing agent layer, and a coated film can be formed which do not cause the degradation of the polyester film even if the polyester film is exposed to heat, water (moisture) and the like.SOLUTION: This invention relates to a resin composition in which polycarbonatepolyol (A) having a weight average molecular weight of 200 to 2,000 is dispersed in an aqueous medium (C) by a urethane resin (B) having a hydrophilic group and a polyester structure.

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Inventors:

Kuriyama Chisato
Chiyonobu Kazuhiko
Mitsuru Kitada

Application Number:

JP2011216916A

Publication Date:

June 01, 2016

Filing Date:

September 30, 2011

Export Citation:

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Assignee:

DIC Corporation

International Classes:

C08L75/06; B32B7/12; C08K5/3492; C08L23/00; C08L61/28; C08L69/00; C09J7/02; C09J151/00; C09J161/28; C09J169/00; C09J175/06

Domestic Patent References:

JP2005089511A
JP5156043A
JP2011140124A
JP2010280842A
JP2009215414A
JP2005154721A

Foreign References:

US4833036

Attorney, Agent or Firm:

Kono Tsuyo

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