Title:
The resin composition which has optical hardenability and thermosetting, and dry film solder resist
Document Type and Number:
Japanese Patent JP5977361
Kind Code:
B2
Abstract:
The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.
Inventors:
SEEK
Byun-Joo Choi
Wu-Jae Jung
Bo Yoon Choi
Gwang-Joo Lee
Min-Su Jung
Byun-Joo Choi
Wu-Jae Jung
Bo Yoon Choi
Gwang-Joo Lee
Min-Su Jung
Application Number:
JP2014544685A
Publication Date:
August 24, 2016
Filing Date:
February 20, 2013
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
G03F7/027; C08F2/50; G03F7/004; G03F7/031
Domestic Patent References:
| JP2002357900A | ||||
| JP2011164305A | ||||
| JP2011164306A | ||||
| JP2011197269A | ||||
| JP8188702A | ||||
| JP2006518774A |
Foreign References:
| WO2012018126A1 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe
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