Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP7119920
Kind Code:
B2
Abstract:
Disclosed is a resin composition capable of obtaining a cured product having low roughness, high peel strength, excellent water resistance and excellent flexibility. The resin composition contains (A) an epoxy resin, (B) a curing agent, (C) a fluorine-based organic filler and (D) a polyimide resin, and is characterized in that the content of the component (D) is 12 mass% or more when the nonvolatile component in the resin composition is considered as 100 mass%.

Inventors:
Kazuhiko Tsurui
Masatoshi Watanabe
Application Number:
JP2018208432A
Publication Date:
August 17, 2022
Filing Date:
November 05, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08G59/40; C08K3/013; C08L27/12; C08L79/08; H05K1/03; H05K3/46
Domestic Patent References:
JP61072025A
JP1123848A
JP10231362A
JP11097578A
JP2018141053A
JP2005272722A
JP2014058592A
JP2019104843A
JP2013199645A
Attorney, Agent or Firm:
Sakai International Patent Office