Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP7219751
Kind Code:
B2
Abstract:
A resin composition can be used as a raw material of a primer, and capable of superior solution stability, adhesion to a non-polar substrate, and/or chipping resistance in a coating film formed from the composition. The resin composition includes a component A: a modified polyolefin resin, and a component B: a polymer having a functional group at least in a terminal thereof, and having a number-average molecular weight in a range of 1,000 to 20,000, and containing a constituent unit (i) derived from a (meth)acrylate ester of a formula, CH2═C(R1)COOR2, wherein R1 is a hydrogen atom or a methyl group, R2 is a —CnH2n+1 group, and n is an integer of 1 to 18)
Inventors:
Katsu Shinno
Hitomi Abe
Junichi Hayakawa
Minoru Yada
Naosuke Takamoto
Hitomi Abe
Junichi Hayakawa
Minoru Yada
Naosuke Takamoto
Application Number:
JP2020503616A
Publication Date:
February 08, 2023
Filing Date:
February 28, 2019
Export Citation:
Assignee:
NIPPON PAPER INDUSTRIES CO.,LTD.
International Classes:
C08L23/28; C08L33/06; C09D5/00; C09D123/00; C09D133/06
Domestic Patent References:
| JP2007291282A | ||||
| JP2005281519A | ||||
| JP57044645A | ||||
| JP2007238719A | ||||
| JP2001002977A | ||||
| JP10298490A | ||||
| JP6336568A | ||||
| JP7304913A | ||||
| JP2016538370A | ||||
| JP60123565A | ||||
| JP5239292A |
Attorney, Agent or Firm:
Sakai International Patent Office