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Title:
A resist composition, a resist pattern formation method
Document Type and Number:
Japanese Patent JP5978137
Kind Code:
B2
Abstract:
A resist composition including: a base component (A) that exhibits changed solubility in a developing solution by the action of acid; a photoreactive quencher (C); and an acid generator component (B) that generates acid upon exposure, wherein the photoreactive quencher (C) contains a compound (C) represented by general formula (C1) shown below. In the formula, X represents a cyclic group of 3 to 30 carbon atoms which may have a substituent; R1 represents a divalent linking group; R2 represents an arylene group which may have a substituent, and each of R3 and R4 independently represents an aryl group which may have a substituent; R3 and R4 may be mutually bonded with the sulfur atom to form a ring; R5 represents a hydroxy group, a halogen atom, an alkyl group of 1 to 5 carbon atoms, an alkoxy group or a fluorinated alkyl group; p represents an integer of 0 to 2; and q represents an integer of 0 to 3.

Inventors:
Yoshimuro Komuro
Toshiaki Hado
Application Number:
JP2013003930A
Publication Date:
August 24, 2016
Filing Date:
January 11, 2013
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; C07C65/10; C07C65/11; C07C381/12; C08F2/44; G03F7/039
Domestic Patent References:
JP201116970A
JP2012141458A
JP2010047668A
JP2009265609A
JP2012140620A
Foreign References:
WO2010095698A1
WO2011040175A1
WO2010134477A1
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Suzuki Mitsuyoshi
Mitsunaga Igarashi