Title:
A resistor and a temperature sensor
Document Type and Number:
Japanese Patent JP6225295
Kind Code:
B2
Abstract:
A resistor which is able to have a reduced thickness for an insulating substrate and in which occurrence of cracking is able to be suppressed during production of the insulating substrate, the production of the resistor and mounting of the substrate, and in which the safety of a medical device is increased by forming the insulating substrate using a biocompatible material; and a temperature sensor are provided. This resistor is provided with: an insulating substrate that has a bending strength of 690 MPa or more and a thickness of 10 to 100 μm; a resistive film that is formed on the insulating substrate; at least a pair of electrode layers, that are electrically connected to the resistive film; and a protective film that covers a region where the resistive film is formed, while forming exposure portions so that at least parts of the electrode layers are exposed therein.
Inventors:
Takashi Matsushita
Application Number:
JP2017510593A
Publication Date:
November 01, 2017
Filing Date:
September 09, 2016
Export Citation:
Assignee:
semitec corporation
International Classes:
H01C7/00; H01C7/02
Domestic Patent References:
| JP2014116456A | ||||
| JP2014090049A | ||||
| JP2013197367A | ||||
| JP2000277662A | ||||
| JP2015153872A |
Attorney, Agent or Firm:
Junichi Izumi
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