Title:
A sealing agent constituent for solar cells, a manufacturing method for the same, the sealing agent layer for solar cells using it, and a solar cell module
Document Type and Number:
Japanese Patent JP6178126
Kind Code:
B2
Abstract:
The present invention relates to providing a solar cell sealant composition in which, at a molding temperature at which there is substantially no decomposition of organic peroxides, an organic compound additive having a melting point higher than the molding temperature has been uniformly dispersed in an ethylene copolymer, and to a production method for the same. The present invention also relates to a solar cell sealant layer in which an organic compound additive having a melting point higher than the molding temperature is uniformly dispersed in an ethylene copolymer, and to a solar cell module employing the same. Also provided is a production method for a solar cell sealant composition containing an ethylene copolymer (A) and an organic compound additive (B), wherein the production method for a solar cell sealant composition is characterized by including a step in which the ethylene copolymer (A) and the organic compound additive (B) are mixed, within a temperature range at or above the Vicat softening point of the ethylene copolymer, and at or below a temperature 10°C below the softening point of the ethylene copolymer (A).
Inventors:
Youda Senda
Hisashige Onouchi
Hisashige Onouchi
Application Number:
JP2013125401A
Publication Date:
August 09, 2017
Filing Date:
June 14, 2013
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08L23/08; C08L31/04; H01L51/46
Domestic Patent References:
| JP2003104976A | ||||
| JP2012119455A |
Foreign References:
| WO2011016557A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office