The sealing method and the resin composition for wafer level closure of a wafer

Title:

The sealing method and the resin composition for wafer level closure of a wafer

Document Type and Number:

Japanese Patent JP6231344

Kind Code:

B2

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Inventors:

Kushihara direct
Shoichi Nagata
Kazumasa Sumita
Tetsuya Uehara
Kenji Hagiwara

Application Number:

JP2013212632A

Publication Date:

November 15, 2017

Filing Date:

October 10, 2013

Export Citation:

Assignee:

Shin-Etsu Chemical Co., Ltd.

International Classes:

H01L23/29; C08G73/06; H01L21/56; H01L23/31

Domestic Patent References:

Foreign References:

WO2000059036A1

Attorney, Agent or Firm:

Mikio Yoshimiya
Toshihiro Kobayashi

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