Title:
SEMICONDUCTIVE POLYAMIDE RESIN COMPOSITION, MOLDING PREPARED THEREWITH AND SEAMLESS BELT FOR ELECTROPHOTOGRAPHY
Document Type and Number:
Japanese Patent JP2017066388
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductive polyamide resin composition excellent in the uniformity of electric resistance of a semiconductive region and also excellent in the increase of electric resistance due to energizing.SOLUTION: The present invention provides a semiconductive polyamide resin composition comprising a polyamide resin (A) comprising a diamine constitutional unit predominantly composed of a xylylene diamine-derived constitutional unit and a dicarboxylic acid constitutional unit, and a fine carbon fiber (B). The semiconductive polyamide resin composition makes it possible to give a molding having a small increase of electric resistance due to energizing.SELECTED DRAWING: None
Inventors:
TAKECHI SHIGETOSHI
UMEKI TATSURO
NAKAMURA NAOKI
UMEKI TATSURO
NAKAMURA NAOKI
Application Number:
JP2016187095A
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
OKURA INDUSTRIAL CO LTD
International Classes:
C08L77/06; C08G69/26; C08K3/04; C08K7/06; G03G15/00; G03G15/16
Domestic Patent References:
| JP2007154100A | 2007-06-21 | |||
| JP2011184681A | 2011-09-22 | |||
| JP2014240146A | 2014-12-25 | |||
| JP2000347513A | 2000-12-15 |
Foreign References:
| WO2014199045A1 | 2014-12-18 | |||
| WO2011027863A1 | 2011-03-10 |
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