Title:
Power semiconductor device
Document Type and Number:
Japanese Patent JP6316412
Kind Code:
B2
Abstract:
Herein provided are: a ceramic board; a semiconductor element for electric power, on one surface of which an electrode is formed, and the other surface of which is bonded to the ceramic board; a lead terminal, one end side of which is bonded to the electrode, and the other end side of which is to be electrically connected to an outside thereof; and a sealing member by which the semiconductor element for electric power is sealed together with a part, in the lead terminal, bonded to the electrode; wherein, near an end in said one end side of the lead terminal, an inclined surface is formed which becomes farther from the circuit board as it becomes closer to the end.
Inventors:
Junji Fujino
Mikio Ishihara
Masayoshi Shinkai
Hiroyuki Harada
Mikio Ishihara
Masayoshi Shinkai
Hiroyuki Harada
Application Number:
JP2016521067A
Publication Date:
April 25, 2018
Filing Date:
May 15, 2015
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| JP200495965A | ||||
| JP201351295A |
Foreign References:
| WO2013111276A1 |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
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