Title:
A semiconductor device provided with the substrate for semiconductor device loading, and it
Document Type and Number:
Japanese Patent JP6235272
Kind Code:
B2
Inventors:
Yusuke Takei
Application Number:
JP2013179854A
Publication Date:
November 22, 2017
Filing Date:
August 30, 2013
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H01L23/36; H01L33/62
Domestic Patent References:
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| JP2013115088A | ||||
| JP2002203989A | ||||
| JP2005210057A | ||||
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| JP62035693A | ||||
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