Title:
A semiconductor emission device and its manufacturing method
Document Type and Number:
Japanese Patent JP6146734
Kind Code:
B2
Abstract:
A lighter and smaller light-emitting device (for use in a vehicle lighting unit) using a light-emitting body (13) and a manufacturing method of the light-emitting body (13) are provided. The light-emitting device can include a light source (14) configured to emit light for excitation, and a light-emitting body (13) configured to absorb excitation light to emit fluorescence light. The light-emitting body (13) can include: a first light-transmitting member (30a) with a plate shape and having a first surface (13a), a second surface (13b) opposite to the first surface (13a), and an outer peripheral surface between the first surface (13a) and the second surface (13b); a phosphor layer (31) disposed on the outer peripheral surface of the first light-transmitting member (30a); a second light transmitting member (30b) disposed on an outer peripheral surface of the phosphor layer (31); and a light-shielding member (15) (such as a reflection film) configured to cover the first surface (13a). In this light-emitting device, the light source (14) can be disposed such that the excitation light therefrom can be incident on the second surface (13b), pass through the first light-transmitting member (30a), and reach the phosphor layer (31).
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Inventors:
Naoto Suzuki
Application Number:
JP2013056644A
Publication Date:
June 14, 2017
Filing Date:
March 19, 2013
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
F21S8/10; F21V9/16; H01L33/50; H01S5/02
Domestic Patent References:
| JP2011503891A | ||||
| JP2007059612A |
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