Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023128114
Kind Code:
A
Abstract:
To suppress wiring resistance from increasing.SOLUTION: Electric conductive members 60 are arranged at wiring parts of circuit patterns 32, 31 respectively. Currents flowing at the wiring parts flow through even an electric conductive member 60. Consequently, the wiring parts decrease in wiring resistances and also decrease in loss to reduce heat generation by Joule heat. Namely, semiconductor chips 40b, 40d can be arranged nearby the circuit patterns 32, 31 having a risk of heat generation, and the semiconductor chips 40b, 40d increase in degree of freedom of arrangement. Further, even if a region where wiring resistance is improved is formed by reducing the volume of circuit patterns 31 to 36, heat generation can be reduced by providing an electric conductive members 60 in such an area. Consequently, a semiconductor module can be made compact while maintaining its reliability.SELECTED DRAWING: Figure 3
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Inventors:
YAMAGUCHI SOTA
Application Number:
JP2022032233A
Publication Date:
September 14, 2023
Filing Date:
March 03, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L25/07; H01L23/12
Attorney, Agent or Firm:
Patent Attorney Corporation Fuso International Patent Office