Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023161091
Kind Code:
A
Abstract:
To prevent the occurrence of short circuiting, even when water droplets attach to a lead frame.SOLUTION: A wiring protection part 35 covers some of first and second lead frames 51, 52, and has an inclusion plane 35a where the first and second lead frames 51, 52 are projected. The inclusion plane 35a includes a semiconductor chip and a water stop part 36 between the first and second lead frames 51, 52 that is parallel to the semiconductor chip and projects to the inclusion plane 35a. In this case, even when water droplets propagating along the first and second lead frames 51, 52 reach the inclusion plane 35a, the movement of water droplets on the inclusion plane 35a to the opposing first and second lead frames 51, 52 is prevented by the water stop part 36. Therefore, the short circuiting of the first and second lead frames 51, 52 is prevented, thereby making it possible to suppress a decrease in the reliability of a semiconductor device.SELECTED DRAWING: Figure 6
Inventors:
MARUYAMA RIKIHIRO
ODA YOSHINORI
HARADA TAKAHITO
ODA YOSHINORI
HARADA TAKAHITO
Application Number:
JP2022071243A
Publication Date:
November 07, 2023
Filing Date:
April 25, 2022
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01L25/07
Attorney, Agent or Firm:
Patent Attorney Corporation Fuso International Patent Office