Title:
半導体装置
Document Type and Number:
Japanese Patent JP7118259
Kind Code:
B2
Abstract:
Provided are: a semiconductor chip (8); a conductive base plate (4) which is connected to the semiconductor chip (8); an insulating outer wall (2) which encloses the semiconductor chip (8); a conductive cover plate (3) which faces the semiconductor chip (8) and blocks the outer wall (2); a conducting member (5) which is provided between the semiconductor chip (8) and the cover plate (3) and connects the semiconductor chip (8) and the cover plate (3); an elastic member which is provided in a recess (5a) of the conducting member (5) and is biased so as to depress an electrode of the semiconductor chip (8) via the conducting member (5); and a conductivity maintaining part (5d) which maintains contact between the cover plate (4) and the conducting member (5), wherein the conducting member (5) has a shape which has rotational symmetry relative to a central axis (5c) of the recess (5a).
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Inventors:
Kadowaki Kazutake
Yoshikazu Yaji
Yuuki Shioda
Kunihiko Tajiri
Tetsuya Matsuda
Tetsuo Motomiya
Fujita Shigeto
Yoshikazu Yaji
Yuuki Shioda
Kunihiko Tajiri
Tetsuya Matsuda
Tetsuo Motomiya
Fujita Shigeto
Application Number:
JP2021519976A
Publication Date:
August 15, 2022
Filing Date:
May 22, 2019
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L23/48; H01L25/18
Domestic Patent References:
| JP2005502213A | ||||
| JP2015528214A |
Foreign References:
| WO2018051389A1 |
Attorney, Agent or Firm:
Parumo Patent Attorneys Office