Title:
半導体装置
Document Type and Number:
Japanese Patent JP7455222
Kind Code:
B2
Abstract:
Provided is a semiconductor device in which a bonding state between a bonding object and a terminal is improved. The semiconductor device includes a bonding object, a case, and a terminal. The bonding object includes a metal pattern. The case includes a frame body and accommodates the bonding object inside the frame body. The terminal includes a first end and a second end. The first end is bonded to the metal pattern of the bonding object. The second end is led out of the case from the first end. The bonding object is an insulating substrate or a semiconductor element held on an insulating substrate. The case includes a beam bridging across a space inside frame body. The beam holds a portion of the terminal between the first end and the second end.
Inventors:
Yasuhiro Sakai
Application Number:
JP2022556851A
Publication Date:
March 25, 2024
Filing Date:
October 20, 2020
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/04
Domestic Patent References:
| JP2018006697A | ||||
| JP2009200416A | ||||
| JP2019067885A | ||||
| JP2003249624A |
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita