Title:
SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2016171277
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element capable of improving the efficiency and a manufacturing method thereof.SOLUTION: The semiconductor light-emitting element includes: a substrate; a first semiconductor layer of a first conduction type; a second semiconductor layer of a second conduction type, which is formed between the substrate and the first semiconductor layer; a third semiconductor layer formed between the first semiconductor layer and the second semiconductor layer; and a metal layer formed between the substrate and the second semiconductor layer. The substrate has a first plane at the metal layer side and a second plane at the opposite side of the first plane. The second plane has a convex shape.SELECTED DRAWING: Figure 1
Inventors:
HUANG JONG-IL
KATSUNO HIROSHI
KATSUNO HIROSHI
Application Number:
JP2015051703A
Publication Date:
September 23, 2016
Filing Date:
March 16, 2015
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L33/20; H01L33/32
Attorney, Agent or Firm:
Masahiko Hinataji