A sensor device and a sensor - Seiko Epson Corporation

Title:

A sensor device and a sensor

Document Type and Number:

Japanese Patent JP5999143

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a sensor device capable of reducing a thickness, a method for manufacturing this sensor device, a motion sensor using this sensor device, and a method for manufacturing this motion sensor.SOLUTION: A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided on an active surface 10a side of the silicon substrate 10; an external connection terminal 12 electrically connected to the first electrode 11 and provided on the active surface 10a side; a stress-relieving layer 15 provided between the silicon substrate 10 and the external connection terminal 12; a connection terminal 13 provided on the active surface 10a side of the silicon substrate 10; and a vibration gyro element 20 as a sensor element provided with a substrate 21, each vibration arm extended from the substrate 21, and an extraction electrode 29 as a connection electrode. The vibration gyro element 20 is held by the silicon substrate 10 by the connection between the extraction electrode 29 and the external connection terminal 12.

Inventors:

Tetsuya Otsuki

Application Number:

JP2014129277A

Publication Date:

September 28, 2016

Filing Date:

June 24, 2014

Export Citation:

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