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Title:
A sheet type epitaxial wafer manufacture device and a manufacturing method of an epitaxial wafer using it
Document Type and Number:
Japanese Patent JP6047854
Kind Code:
B2
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Inventors:
Kazunari Suda
Application Number:
JP2013005313A
Publication Date:
December 21, 2016
Filing Date:
January 16, 2013
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/205; C23C16/458; H01L21/683
Domestic Patent References:
JP2000103696A
JP2005260095A
JP2007522681A
JP2001508599A
JP2007088303A
JP2008235830A
Attorney, Agent or Firm:
Shinsuke Ishihara
Shoji Ishihara



 
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