Manufacturing method of stretchable sheet and laminated chip

Japanese Patent JP6306362

B2

To provide an extensible sheet suitable for manufacturing a laminated chip containing the farthest protruding part on a workpiece provided with a plurality of protrusions, and a method of using the extensible sheet to manufacture the laminated chip. An extension sheet 10 is provided, which comprises a heat-shrinkable substrate 1 and an adhesive layer 2 laminated on one main surface of the substrate 1; a processing region 10a, which consists of a first region 11a and a second region 12a, wherein the first region 11a uses the periphery of the processing region 10a as its circumferential annular region in plane view, and the second region 12a is located at the inner peripheral side of the annular region of the first region 11a and includes a center in the plane view of the processing region 10a. The aforementioned processing region, which can be set at the first main surface on the main surface at one side of the adhesive layer 2 closer than the substrate 1 of the aforementioned extensible sheet 10, should be adhered on the workpiece 20 provided with a plurality of protruding parts 22 on the substrate 21 in a thickness direction at the time of use. Using the second region 12 a as a reference, the first region 11a includes a surface 11pa formed with a first protruding part 11p protruding from the substrate 1.

Nakamura Yuchi
Miyanaga Tomoji
Yukinori Murakami

JP2014025773A

April 04, 2018

February 13, 2014

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LINTEC CORPORATION

C09J7/20; C09J201/00; H01L21/301

JP2014165233A
JP2007005530A
JP2005142365A
JP2011216508A
JP2007324456A
JP2002226804A
JP2013256634A
JP2009110995A

WO2009110426A1
WO2013161891A1

Yuji Hayakawa
Keisuke Murasame

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