Title:
シールドコネクタ
Document Type and Number:
Japanese Patent JP7211914
Kind Code:
B2
Abstract:
A shield connector includes a shield member for covering an outer periphery of a terminal, and a substrate mounting surface provided on the shield member and fixed to a surface of a substrate via solder, wherein the substrate mounting surface has a reference surface and a stepped surface having a different height with respect to the reference surface. For example, the stepped surface is formed by at least one of a convex portion protruding from the reference surface of the substrate mounting surface and a concave portion recessed from the reference surface of the substrate mounting surface.
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| WO/2017/131349 | CONNECTOR |
| JP7351665 | connector |
| WO2003047039 | INTERSTITIAL GROUND ASSEMBLY FOR CONNECTOR |
Inventors:
Kei Wada
Takayuki Kobayashi
Kameyama Isao
Takayuki Kobayashi
Kameyama Isao
Application Number:
JP2019156445A
Publication Date:
January 24, 2023
Filing Date:
August 29, 2019
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R13/6587; H01R12/70
Domestic Patent References:
| JP2013125581A | ||||
| JP2015060815A | ||||
| JP4130760A | ||||
| JP2000231945A | ||||
| JP58089850A | ||||
| JP60144243U | ||||
| JP2001230362A | ||||
| JP2007165252A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu