A shrink label mounting method, a shrink label mounting device

Title:

A shrink label mounting method, a shrink label mounting device

Document Type and Number:

Japanese Patent JP5942458

Kind Code:

B2

Inventors:

Takayuki Aikawa
Maeda Koji
Tsurumoto High
Shigematsu Kaeiko
Jotaro Nagao

Application Number:

JP2012029011A

Publication Date:

June 29, 2016

Filing Date:

February 14, 2012

Export Citation:

Assignee:

Toyo Seikan Co., Ltd.

International Classes:

B65B53/02; B65D1/02; B65D23/08

Domestic Patent References:

Attorney, Agent or Firm:

Hiromichi Kobayashi
Uzawa Hidehisa
Tsuyoshi Hashimoto

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