Title:
はんだ合金
Document Type and Number:
Japanese Patent JP7474797
Kind Code:
B2
Abstract:
To provide a solder alloy that can suppress re-melting of a solder joint to be formed in high temperature environments.SOLUTION: A solder alloy contains 0.1-3 mass% of Ag, 8-15 mass% of Cu and 30-40 mass% of Sb, with the remainder being Sn.SELECTED DRAWING: Figure 1
Inventors:
Ken Nakano
Isao Sakamoto
Shoichiro Naruse
Toshiaki Shimada
Koichi Ohkubo
Isao Sakamoto
Shoichiro Naruse
Toshiaki Shimada
Koichi Ohkubo
Application Number:
JP2022046663A
Publication Date:
April 25, 2024
Filing Date:
March 23, 2022
Export Citation:
Assignee:
Tamura Manufacturing Co., Ltd.
International Classes:
B23K35/26; B23K35/22; C22C13/02; C22C30/04
Domestic Patent References:
| JP2018047489A | ||||
| JP2004298931A | ||||
| JP2005122970A | ||||
| JP2005340268A |
Foreign References:
| KR1020200082107A | ||||
| WO2020122253A1 | ||||
| US20060193744 |
Attorney, Agent or Firm:
Youko Ohta