A solder constituent for laser soldering, and a mounting method using it

Title:

A solder constituent for laser soldering, and a mounting method using it

Document Type and Number:

Japanese Patent JP6138464

Kind Code:

B2

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Inventors:

Tsuyoshi Onoki
Toshiyuki Iijima
Satoshi Hasegawa
Kenji Fujimori

Application Number:

JP2012256164A

Publication Date:

May 31, 2017

Filing Date:

November 22, 2012

Export Citation:

Assignee:

TAMURA CORPORATION OF CHINA LIMITED

International Classes:

B23K35/363; B23K1/00; B23K1/005; B23K3/06; H05K3/34

Domestic Patent References:

Foreign References:

WO2004108345A1

Attorney, Agent or Firm:

Intellectual Property Office

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