Title:
A solid-state lighting module provided with the improved heat spreader
Document Type and Number:
Japanese Patent JP6045597
Kind Code:
B2
Abstract:
A solid state lighting module (102) for attachment to a socket (103) through rotation of the solid state lighting module around an axis of rotation (111). The solid state lighting module (102) comprises at least one solid state light-source (112); a heat spreading member (104) having two surfaces arranged opposite each other and in thermal connection with each other, the first surface (114) being in thermal connection with the solid state light-source (112); and fastening means (109) arranged to co-operate with fastening means (113) comprised in the socket (103) to bring the second surface (115) of the heat spreading member (104) in thermal connection with a heat sink (110) comprised in the socket (103). The second surface (115) of the heat spreading member (104) has a surface topography with at least one peak (119) and at least one valley (120) arranged concentrically in relation to the axis of rotation (111).
Inventors:
Kleussen Martinus Petrus
Troil Neat Theodor Cornellis
Peters Henrix Marie
Troil Neat Theodor Cornellis
Peters Henrix Marie
Application Number:
JP2014541779A
Publication Date:
December 14, 2016
Filing Date:
November 06, 2012
Export Citation:
Assignee:
Philips Lighting Holding BV
International Classes:
F21S2/00; F21V19/00; F21V29/503; F21V29/74; H01L33/00
Domestic Patent References:
| JP2007042755A | ||||
| JP2007088100A |
Foreign References:
| WO2010146509A1 |
Attorney, Agent or Firm:
Patent Services Corporation m&s Partners
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