Title:
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH065658
Kind Code:
A
Abstract:
PURPOSE: To enable a semiconductor chip bonded by wires and a film carrier to be kept in a firmly fixed state in a semiconductor device where the semiconductor chip is mounted on the film carrier and bonding wires are used for wiring.
CONSTITUTION: A semiconductor chip 11 is mounted on a film carrier 1, the circumference of the semiconductor chip 11 is sealed up with resin 21 excluding pads 4a needed for bonding wires on the film carrier 1. Another semiconductor chip 12 is mounted on the semiconductor chip 11, the electrode 12a of the semiconductor chip 12 and the pads 4a are connected together with bonding wires 10. Furthermore, the circumference of the semiconductor chip 12 is sealed up with resin 22 including the bonding wires 10.
Inventors:
IMADA MASAFUMI
Application Number:
JP18865892A
Publication Date:
January 14, 1994
Filing Date:
June 23, 1992
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
H01L21/56; H01L21/60; (IPC1-7): H01L21/60; H01L21/56
Attorney, Agent or Firm:
Kokubun Takaetsu
Next Patent: MOUNTING METHOD OF SEMICONDUCTOR ELEMENT