Title:
A substrate conveying method in a substrate parting device and a substrate parting device
Document Type and Number:
Japanese Patent JP6101143
Kind Code:
B2
Inventors:
Hitoshi Nishio
Application Number:
JP2013096121A
Publication Date:
March 22, 2017
Filing Date:
May 01, 2013
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
C03B33/03; B65G23/38
Domestic Patent References:
| JP2007075964A | ||||
| JP49023269B1 | ||||
| JP2010026267A | ||||
| JP48022157B1 | ||||
| JP2001261141A | ||||
| JP5132118A | ||||
| JP8085658A |
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