Title:
A substrate pinching mechanism, a substrate fixing device, and board inspection equipment
Document Type and Number:
Japanese Patent JP6234836
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To successfully clamp a substrate while achieving downsizing.SOLUTION: A substrate clamping mechanism comprises: a pair of clamping members 31a, 31b capable of clamping an outer periphery 101 of a substrate 100 with respective edges E1, E3 which are arranged to face each other and along a length direction; and a pair of air cylinders for exerting clamping force to clamp the outer periphery 101 by the respective edges E1, E3 on both ends of the respective clamping members 31a, 31b. The substrate clamping mechanism comprises a drive mechanism 33 provided at a central part C of the clamping members 31a, 31b in the length direction, for exerting clamping force on the central part C. The drive mechanism 33 includes: an air chamber S which is formed at the central part C of the clamping member 31a and capable of reserving compressed air supplied; and a plunger 63 with a tip attached to the clamping member 31b, which is arranged in the air chamber S in a movable manner in a direction where the clamping members 31a, 31b contact or separate from each other. With supply of compressed air to the air chamber S, force that the plunger 63 pulls the clamping member 31b is exerted on the central part C as clamping force.
Inventors:
Yasumi Nakajima
Application Number:
JP2014022523A
Publication Date:
November 22, 2017
Filing Date:
February 07, 2014
Export Citation:
Assignee:
Hioki Electric Co., Ltd.
International Classes:
H05K3/00; G01R31/02; H05K13/08
Domestic Patent References:
| JP2000304814A | ||||
| JP2011060981A | ||||
| JP6186271A | ||||
| JP2011146582A | ||||
| JP2002510432A |
Attorney, Agent or Firm:
Shinji Sakai