A substrate for radio frequency modules, and a manufacturing method for the same

Title:

A substrate for radio frequency modules, and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6002477

Kind Code:

B2

Inventors:

Okawa Tadao
Ryoto Matsutomi
Tomoyuki Kasagi
Hiroko Ikenaga

Application Number:

JP2012149333A

Publication Date:

October 05, 2016

Filing Date:

July 03, 2012

Export Citation:

Assignee:

NITTO DENKO CORPORATION

International Classes:

H01Q13/08; H01P11/00; H05K1/02

Domestic Patent References:

Attorney, Agent or Firm:

Yoshito Fukushima

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