Title:
A substrate treating method and a substrate processing device
Document Type and Number:
Japanese Patent JP6024272
Kind Code:
B2
Abstract:
A preprocess step for supplying an inert gas into an enclosed space in which a substrate is disposed, while exhausting gas by sucking out of the enclosed space. And then, an etching step for supplying a process vapor into the enclosed space while exhausting gas out of the enclosed space at an rate lower than a rate in the preprocess step. And then a post-process step for supplying an inert gas into the enclosed space while exhausting gas by sucking out of the enclosed space at a rate higher than the rate in the etching step.
Inventors:
Takashi Ota
Akio Hashizume
Takahiro Yamaguchi
Yuya Akanishi
Akio Hashizume
Takahiro Yamaguchi
Yuya Akanishi
Application Number:
JP2012177220A
Publication Date:
November 16, 2016
Filing Date:
August 09, 2012
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/302; H01L21/304; H01L21/306
Domestic Patent References:
| JP9017766A | ||||
| JP54013778A | ||||
| JP54108579A | ||||
| JP2026026A | ||||
| JP4245431A | ||||
| JP2005150332A | ||||
| JP2002075955A | ||||
| JP2000195847A |
Foreign References:
| US6576151 |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Masahide Yasuda
Mio Kawasaki
Masahide Yasuda