Title:
A substrate treating method and a substrate processing device
Document Type and Number:
Japanese Patent JP6222818
Kind Code:
B2
Abstract:
A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.
Inventors:
Negoro world
Yasuhiko Nagai
Keiji Iwata
Yasuhiko Nagai
Keiji Iwata
Application Number:
JP2013187627A
Publication Date:
November 01, 2017
Filing Date:
September 10, 2013
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/027; H01L21/304
Domestic Patent References:
JP2000223394A | ||||
JP2008060368A | ||||
JP2008066400A | ||||
JP2011233902A | ||||
JP6196397A |
Foreign References:
US20110265822 |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Goromaru Masami
Mio Kawasaki
Goromaru Masami
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