A substrate for two-layer flexible wiring, flexible patchboards, and those manufacturing methods

Title:

A substrate for two-layer flexible wiring, flexible patchboards, and those manufacturing methods

Document Type and Number:

Japanese Patent JP6083433

Kind Code:

B2

Inventors:

Hiroshi Takenouchi
Masashi Noguchi
Mr. Kogami
Hiroki Hata
Shimamura Tomio
Yoshihide Nishiyama

Application Number:

JP2014512436A

Publication Date:

February 22, 2017

Filing Date:

March 28, 2013

Export Citation:

Assignee:

Sumitomo Metal Mining Co., Ltd.

International Classes:

H05K1/03; C25D5/18; C25D7/00; H05K1/09

Domestic Patent References:

Attorney, Agent or Firm:

Yoshitaka Oshida

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