Title:
A substrate with even some or all of at least one surface, and its use
Document Type and Number:
Japanese Patent JP6082106
Kind Code:
B2
Abstract:
A substrate, at least one surface of which is partially or entirely flat, the substrate having: a substrate molded from first substrate-forming particles; second substrate-forming particles partially or entirely filled into first pores which are formed by the first substrate-forming particles on at least one surface of the substrate; and a polymer partially or entirely filled into second pores remaining in a region in which the second substrate-forming particles are filled. Also disclosed is a method for preparing a thin or thick film, including the aligning non-spherical seed crystals on a flat portion of at least one surface of the substrate such that an a-axis, a b-axis, and/or a c-axis are oriented according to a certain rule; and exposing the aligned seed crystals to a solution for enabling the growth of the seed crystals to thereby form and grow a film from the seed crystals using a secondary growing technique.
Inventors:
Yong Kyung Byung
Pham Khao Ta Thun
Kim Hyun Sung
Pham Khao Ta Thun
Kim Hyun Sung
Application Number:
JP2015517156A
Publication Date:
February 15, 2017
Filing Date:
June 15, 2012
Export Citation:
Assignee:
Intellectual Discovery Company Limited
International Classes:
C30B29/22; B01D69/10; B01D69/12; B01D71/02
Domestic Patent References:
JP2005028248A | ||||
JP2000026115A | ||||
JP2004344755A | ||||
JP2003238147A |
Foreign References:
WO2012033347A2 |
Attorney, Agent or Firm:
Maeda patent office
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