ICチップのための熱交換器への流体温度および熱交換器からの流体温度の関数として、ICチップの温度を加熱および冷却される流体で調整するためのシステム

Title:

Document Type and Number:

Japanese Patent JP2004511754

Kind Code:

A

Abstract:

A temperature control system comprises a reservoir that is holding a hot fluid; a heat exchanger, for an electronic component, coupled to an input conduit that carries the hot fluid from the reservoir into the heat exchanger; an output conduit coupled to the heat exchanger, that carries the hot fluid from the heat exchanger back to the reservoir; a first temperature sensor, coupled to the input conduit; and a second temperature sensor, coupled to the output conduit. A heater is coupled to the output conduit which adds heat to the hot fluid in the output conduit in response to a heater control signal; and a cooler is coupled to the reservoir which adds cold fluid to the reservoir in response to a cooler control signal. A temperature controller generates the heater control signal and the cooler control signal as respective functions of both sensed temperatures.

More Like This:

JP2021063660	SOCKET AND SOCKET FOR INSPECTION
JP2003004765	PRESS CONTACT STRUCTURE OF PROBE UNIT

Inventors:

Tustaniusky, Jerry Ior
Babcock, James Whitman

Application Number:

JP2001586479A

Publication Date:

April 15, 2004

Filing Date:

April 30, 2001

Export Citation:

Click for automatic bibliography generation Help

Assignee:

UNISYS CORPORATION

International Classes:

G01R31/26; G01R31/30; G05D23/13; G05D23/19; (IPC1-7): G01R31/30; G01R31/26

Domestic Patent References:

JPH0363485A	1991-03-19
JPH0729967A	1995-01-31
JPH07151441A	1995-06-16
JPH07208827A	1995-08-11
JPH07308592A	1995-11-28
JPH11345870A	1999-12-14
JPH05288801A	1993-11-05
JPS49139663U	1974-12-02

Foreign References:

US4495777A	1985-01-29
US5977785A	1999-11-02
US4060997A	1977-12-06

Attorney, Agent or Firm:

Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai

Previous Patent: JP2004511753

Next Patent: β３−インテグリン依存性細胞内過程に影響を与える方法と化合物