Title:
CARRIER MODULE FOR MICRO BGA TYPE ELEMENT
Document Type and Number:
Japanese Patent JP3133303
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To test an element by quickly connecting to a test socket without damaging a solder ball formed on the bottom of the element when the performance of the completed element is tested.
SOLUTION: This carrier module comprises a carrier module upper body 10 and a lower body 28 having each projection in both side upper parts and lower parts; an element stably fixing unit 12 to be inserted into the carrier module upper body 10 so as to stably fix a micro BGA type element; and an elastic means 26 interposed between carrier module upper and lower bodies 10, 28 and elastically fixed.
Inventors:
San Jae Yoon
Application Number:
JP2000004007A
Publication Date:
February 05, 2001
Filing Date:
January 12, 2000
Export Citation:
Assignee:
MIRAE CORPORATION
International Classes:
G01R1/04; G01R31/26; H01L23/32; H01R33/76; (IPC1-7): H01R33/76; G01R31/26; H01L23/32
Domestic Patent References:
| JP200082554A | ||||
| JP10144439A |
Attorney, Agent or Firm:
Takehiko Suzue (5 outside)