Title:
テープ貼着装置
Document Type and Number:
Japanese Patent JP7396849
Kind Code:
B2
Abstract:
To attach a circular tape to a ring frame and a wafer with uniform tension such that air bubbles do not enter in a tape sticking device.SOLUTION: A tape sticking device 1 includes holding means 2 including a ring frame holding portion 20 and a wafer holding portion 21 in a frame opening, a peel plate 15 that bends a tape unit TU between a unit 80 that sends out the tape unit TU and a unit 82 that winds up a sheet T1 from which the tape T2 has been peeled off and peels the tape T2 from the sheet T1, and a roller 30 formed of an insulator by sticking the tape T2 against the ring frame and the wafer while pressing the tape, the surface portion of the roller 30 is provided with means that charges the opposite charge of the charge of the tape T2 that has been peeled off, and the tape T2 charged by being peeled off from the sheet T1 at the tip of the peel plate 15 is electrostatically attached to the surface portion of the roller 30, and the tape T2 is attached to the ring frame and the wafer by the rolling roller 30.SELECTED DRAWING: Figure 2
More Like This:
| WO/2015/170210 | SEPARATION APPARATUS FOR THIN FILM STACKED BODY |
| JP2004006505 | ELECTROSTATIC CHUCK |
| JP5234665 | Spin head and substrate processing equipment with it |
Inventors:
Fumiaki Ito
Kenta Sento
Kenta Sento
Application Number:
JP2019189466A
Publication Date:
December 12, 2023
Filing Date:
October 16, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/683; B65H37/04; B65H41/00
Domestic Patent References:
| JP2008227224A | ||||
| JP4099321A | ||||
| JP2009231169A | ||||
| JP2016181463A | ||||
| JP2001301727A | ||||
| JP55105448U | ||||
| JP5158288A | ||||
| JP2011086687A |
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office