Title:
テープ貼り装置
Document Type and Number:
Japanese Patent JP7303510
Kind Code:
B2
Abstract:
To enhance yield in which working efficiency is improved by the fact that bending and sticking a tape around a substrate end surface can be surely performed, wrinkles on the tape are not generated and variation in tape application work is eliminated.SOLUTION: Disclosed is a tape sticking device 1 which sticks a tape 11 along the end surface of a substrate 30. This device includes: substrate holding means 4 and 5 for holding the substrate 30 by setting the substrate 30 on a table of the tape sticking device 1; a tape sticking unit 2 for sticking the tape around the end surface of the substrate 30 held by the substrate holding means 4 and 5; and unit moving means 3 which can move the tape sticking unit 2 in a horizontal direction.SELECTED DRAWING: Figure 1
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Inventors:
Koji Suga
Application Number:
JP2018230453A
Publication Date:
July 05, 2023
Filing Date:
December 07, 2018
Export Citation:
Assignee:
Motronics Co., Ltd.
International Classes:
H05K3/28; B65H35/07; B65H37/04; B65H37/06; H01L21/683
Domestic Patent References:
| JP8268632A | ||||
| JP3012931U | ||||
| JP2014162592A | ||||
| JP62093999A | ||||
| JP2009279812A | ||||
| JP61047621U |
Foreign References:
| US4588463 | ||||
| US20040022999 |
Attorney, Agent or Firm:
Yoshinari Niwa