Title:
ディスク成形金型の温度制御機構
Document Type and Number:
Japanese Patent JP4053342
Kind Code:
B2
Abstract:
In an injection molding apparatus 62 on which a disk molding die is mounted, wherein the disk molding die is comprised of a stationary die 10 and a movable die 20, a plurality of principal parts of which are separately temperature controlled by media, a control device 50 of the injection molding apparatus 62 is provided with a temperature control mechanism for controlling temperatures of the media which are pumped by a plurality of temperature control devices 51a and 51b in order to control the temperatures of said principal parts.
Inventors:
Hideaki Shirai
Kenji Fukumoto
Kenji Fukumoto
Application Number:
JP2002118118A
Publication Date:
February 27, 2008
Filing Date:
April 19, 2002
Export Citation:
Assignee:
Meiki Seisakusho Co., Ltd.
International Classes:
B29C45/73; B29C45/26; B29C45/78; B29D17/00
Domestic Patent References:
| JP2000218670A | ||||
| JP3187721A | ||||
| JP4298318A | ||||
| JP1176538A |
Attorney, Agent or Firm:
Noriaki Goto