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Patent Searching and Data


Title:
温度式膨張弁
Document Type and Number:
Japanese Patent JP7173837
Kind Code:
B2
Abstract:
To provide a temperature type expansion valve 10 which eliminates complexity of a structure of a conventional temperature type expansion valve, has weather resistance and durability, and is small and light-weight.SOLUTION: A temperature type expansion valve 10 of the invention includes: a cartridge type expansion valve body 100; and a housing 200 which houses the cartridge type expansion valve body 100. The expansion valve body 100 includes: a valve body part 110 which generally forms an outer shell of the expansion valve body 100; and a temperature sensitive part 120. The temperature sensitive part 120 houses a diaphragm 124 which is displaced in response to a temperature of an outlet side pipeline of an evaporator 20. The valve body part 110 comprises: a metallic press working part 111A in which a lower lid 111Aa which fixes the diaphragm 124 of the temperature sensitive part 120 and a valve seat 111Ab which a needle 141 movably contacts with or separates from are integrally formed by press working; and a resin material part 111B in which the press working part 111A is insert-molded by a resin material.SELECTED DRAWING: Figure 3

Inventors:
▲高▼田 裕正
Yuichiro Toyama
Application Number:
JP2018209144A
Publication Date:
November 16, 2022
Filing Date:
November 06, 2018
Export Citation:
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Assignee:
Saginomiya Co., Ltd.
International Classes:
F25B41/335; F16K27/00; F16K31/68
Domestic Patent References:
JP200839262A
JP200453182A
JP989154A
JP200857949A
JP6273000A
JP201447674A
Attorney, Agent or Firm:
Patent Attorney Tani / Abe Patent Office